The **ATS-54230D-C2-R0** is a high-performance thermal management component, specifically a heat sink designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, known for its high-efficiency cooling in constrained airflow environments. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Dimension (L x W x H)** | 42.4mm x 42.4mm x 23mm | | **Thermal Resistance** | 1.80°C/W (at 200 LFM) | | **Interface Material** | T766 (Thermal Tape) | --- ### Key Design Features #### 1. maxiFLOW™ Geometry The "D" in the part number indicates a specific fin pattern. Unlike traditional straight-fin heat sinks, the maxiFLOW design uses a **tapered fin structure**. This increases the surface area for heat dissipation while maintaining a low pressure drop, making it highly effective for components like CPUs, GPUs, or FPGAs. #### 2. Material and Coating * **Aluminum:** Provides a balance between thermal conductivity and weight. * **Black Anodized Finish:** This is not just aesthetic; an anodized surface increases **emissivity**, allowing for better heat radiation compared to bare aluminum. #### 3. Attachment (Push Pin) The `-R0` suffix typically refers to the mounting kit. This model uses a **push-pin mechanism** with a compression spring. This ensures: * Consistent pressure on the electronic component (Optimal TIM performance). * Mechanical stability in high-vibration environments. * Easy installation through pre-drilled holes on the PCB. --- ### Thermal Performance Data Performance is measured by Thermal Resistance (°C/W). Lower values indicate better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.80 | | 300 (1.5 m/s) | 1.40 | | 400 (2.0 m/s) | 1.20 | | 500 (2.5 m/s) | 1.10 | --- ### Common Applications Due to its dimensions (approx. 42mm square) and thermal efficiency, it is commonly used for: * **Networking Equipment:** Switches and Routers. * **Processing Units:** Mid-range FPGAs (Xilinx/Altera) and ASICs. * **Industrial PCs:** Where passive or assisted airflow is present.