The **ATS-54290R-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, designed specifically for thermal management of electronic components like CPUs, GPUs, FPGAs, and ASICs. ### 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | maxiFLOW™ | | **Thermal Resistance** | 1.30 °C/W (at 200 LFM) | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (High Performance) | | **Shape** | Square, Sloped Fin Design | | **Dimensions (L x W)** | 29mm x 29mm | | **Height** | 24.5mm | --- ### 2. Key Features and Design * **maxiFLOW™ Geometry:** The unique flared fin design increases surface area for maximum heat dissipation in high-velocity airflow environments. * **Material properties:** Made from aluminum for a balance of lightweight construction and high thermal conductivity. The black anodized finish improves radiative heat transfer. * **pushPIN™ Attachment:** This mechanism features a built-in compression spring. It provides a specific pressure (Pre-Assembled) to ensure optimal contact between the heat sink and the electronic component, reducing interfacial thermal resistance. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **SA-708** or a similar high-performance thermal pad, ensuring that there are no air gaps between the chip and the metal. --- ### 3. Application Use Cases This part is typically used in space-constrained electronic assemblies that generate significant heat: 1. **Telecommunications:** High-speed routers and switches. 2. **Computing:** Server CPUs or localized cooling for high-end chipsets. 3. **Industrial:** Power supplies and motor controllers where air cooling is available. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 1.30 | | 300 | 1.00 | | 400 | 0.85 | | 500 | 0.75 |