The **ATS-56008-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs in air-cooled environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 56mm x 56mm x 7.62mm | | **Thermal Resistance** | 2.50° C/W (at 200 LFM) | | **Flow Pattern** | maxiFLOW (High Performance) | | **Compliance** | RoHS Technical Compliant | --- ### 2. Key Design Elements * **maxiFLOW™ Geometry:** The heat sink features a unique spread-fin design. This increases the surface area while reducing pressure drop, allowing for maximum heat dissipation in high-velocity airflow environments. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, this model uses a specialized push-pin system with a built-in compression spring. This ensures: * Consistent pressure across the thermal interface material (TIM). * Secure mounting during mechanical vibration or shock. * **Low Profile:** With a height of only **7.62mm**, it is designed for space-constrained applications like 1U servers, networking switches, or blade modules. --- ### 3. Application Use Cases The ATS-56008-C3-R0 is typically used for the following electronic parts: 1. **High-End Processors:** Cooling for CPUs in embedded systems. 2. **Network Hardware:** Heat management for high-speed switching chips. 3. **Power Electronics:** Dissipating heat from large MOSFET arrays or power management ICs. 4. **FPGA/ASIC:** Providing thermal stability for custom logic chips that generate localized hotspots. --- ### 4. Mounting Hardware Integration When integrating this part into a PCB design, the following holes are required: ```markdown - Required Hole Diameter: 3.175mm (approx.) - Mounting Pattern: Standard square/rectangular layout matching the 56x56 footprint. - Recommended TIM: Phase-change material or high-conductivity thermal grease. ```