The **ATS-56009-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as BGAs (Ball Grid Arrays) and other surface-mount integrated circuits. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-56009-C3-R0 | | **Product Category** | Board Level Heat Sinks | | **Material** | Aluminum (Anodized) | | **Attachment Method** | maxiGRIP™ (Spring Clip) | | **Dimensions (L x W x H)** | 56.00mm x 56.00mm x 9.00mm | | **Thermal Resistance** | Variable (Approx. 4.0°C/W @ 200 LFM) | | **RoHS Status** | Compliant | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (The Fin Structure) * **Material:** Made from extruded aluminum, which provides excellent thermal conductivity while remaining lightweight. * **Low Profile:** At only 9mm in height, it is designed for space-constrained electronic enclosures where vertical clearance is limited. * **Blue Anodized Finish:** The surface treatment improves radiation heat transfer and provides protection against environmental corrosion. #### 2. maxiGRIP™ Attachment System This is the most critical "part" of the assembly. It consists of: * **Plastic Frame Clip:** A high-strength clip that snaps around the component without the need for drilling holes in the Printed Circuit Board (PCB). * **Stainless Steel Spring Clip:** This applies a consistent, steady pressure (clamping force) across the center of the heat sink. This ensures a tight "thermal interface" between the chip and the metal. #### 3. Thermal Interface Material (TIM) * The **"R0"** designation typically refers to the specific pre-applied thermal pad or interface material. * The TIM fills microscopic air gaps between the electronic component (CPU/GPU/FPGA) and the heat sink base to maximize heat transfer efficiency. --- ### Use Cases in Electronics The ATS-56009-C3-R0 is typically used on high-heat generating components such as: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **FPGAs & ASICs:** Managing the thermal load of programmable logic devices. 3. **Industrial Controllers:** Providing passive cooling in environments where fans might fail. ---