The **ATS-56010-C4-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed primarily for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, and GPUs. ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Dimensions (L x W x H)** | 40.0mm x 40.0mm x 10.0mm | | **Thermal Resistance** | 3.50 °C/W (at 200 LFM) | | **Fin Style** | Tapered Fin (maxiFLOW™) | | **Compliance** | RoHS Compliant | --- ### 2. Key Component Features #### A. maxiFLOW™ Fin Design The heat sink features a unique **tapered fin geometry**. Unlike standard straight-fin heat sinks, this design maximizes the surface area for air convection while minimizing pressure drop. This allows for higher efficiency in environments with constrained airflow. #### B. maxiGRIP™ Attachment System The "C4" in the part number refers to the attachment style. The **maxiGRIP™** system uses a high-tension plastic frame clip and a stainless steel spring clip. * **No Holes Required:** It mounts directly to the component without needing holes in the PCB. * **Steady Pressure:** Ensures consistent contact between the heat sink and the electronic chip for optimal heat transfer. * **Safety:** The frame clip acts as a "buffer," preventing the heat sink from shifting and damaging the solder balls on the BGA package. #### C. Thermal Interface Material (TIM) This specific model usually comes pre-assembled with a high-performance thermal pad (often **Phase Change Material** or Chomerics T766). This eliminates the need for manual thermal paste application during assembly. --- ### 3. Common Applications This part is typically found in high-reliability electronic systems where space is limited but heat dissipation is critical: * **Telecommunications:** Network switches and routers. * **Computing:** Embedded systems and server components. * **Industrial:** High-speed data processing units. ---