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  • ATS-P1-69-C2-R0

  • AI
    The **ATS-P1-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and attachment method. | Specification | Details | | :--- | :--- | | **Part Number** | ATS-P1-69-C2-R0 | | **Fin Style** | Straight Fin | | **Material** | Aluminum (typically Blue Anodized) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | Approx. 4.68°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features * **pushPIN™ Attachment:** This model uses a spring-loaded push-pin system. This ensures even pressure across the electronic component, improving heat transfer and preventing damage to the silicon die during installation. * **Straight Fin Geometry:** The vertical parallel fins are optimized for **forced air cooling** (active airflow from a fan). This design offers low resistance to airflow. * **Material and Coating:** The aluminum construction provides a balance between weight and thermal conductivity. The "C2" suffix indicates a **Blue Anodized** finish, which increases surface emissivity and provides corrosion resistance. * **Thermal Interface Material (TIM):** The base comes pre-applied with T766, a phase-change material that fills microscopic air gaps between the heat sink and the electronic part to maximize efficiency. --- ### 3. Application Use Cases This specific heat sink is typically used for cooling components on a Printed Circuit Board (PCB) that generate significant heat: 1. **Field Programmable Gate Arrays (FPGAs):** High-speed processing units used in telecommunications. 2. **Application-Specific Integrated Circuits (ASICs):** Custom chips used in industrial automation or crypto-mining. 3. **Power Electronics:** Voltage regulators and high-wattage power supplies. --- ### 4. Thermal Performance Data Performance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM). ```python # Approximate Thermal Resistance (Lower is better) performance = { "Unducted_Flow": "4.68 °C/W @ 200 LFM", "Ducted_Flow": "2.40 °C/W @ 200 LFM", "Max_Operating_Temp": "Standard industrial range" } ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted airflow for this part?
    • ⤷ Are there alternative attachment methods if my PCB doesn't have holes?
    • ⤷ How does the Blue Anodized finish impact thermal performance compared to bare aluminum?