The **ATS-P2-10-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), microprocessors, and power components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 25.00mm | | **Attachment Method** | Push-Pin (2-pin) | | **Spring Material** | STS304 (Stainless Steel) | | **Thermal Interface** | T766 (Pre-applied phase change material) | --- ### 2. Thermal Performance Data Performance is measured by the thermal resistance ($R_{th}$), indicating how many degrees Celsius the temperature rises per watt of power dissipated ($^\circ C/W$). * **Low Airflow (200 LFM):** ~5.13 $^\circ C/W$ * **High Airflow (700 LFM):** ~1.57 $^\circ C/W$ --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not require electricity), its role in an electronic circuit is critical: * **Thermal Dissipation:** It increases the surface area of a component (like a BGA or FPGA), allowing the ambient air to carry away heat more efficiently. * **Protection:** It prevents "Thermal Throttling" or permanent hardware failure caused by overheating. * **The push-pin mechanism:** Provides a consistent "load" or pressure against the chip, ensuring the thermal interface material (TIM) fills all microscopic gaps between the chip and the metal. --- ### 4. Part Number Breakdown (Naming Convention) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **P2** | Push-Pin Type (2-pin style) | | **10** | Heat Sink Series/Family | | **C2** | Thermal Interface Material (T766) & Material Grade | | **R0** | Revision/Standard Packaging code | ---