The **ATS-P2-101-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal interface material. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Straight Fin | | **Mounting Style** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 6.67°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (High Performance) | --- ### 2. Design and Engineering Features #### A. pushPIN™ Attachment System The "P2" in the part number signifies the use of the **pushPIN™** mounting system. This allows for: * **Ease of installation:** Rapid attachment without specialized tools. * **Compression Springs:** Provides uniform pressure across the component for better thermal contact. * **Secure Fit:** Prevents the heat sink from shifting during vibration or shipping. #### B. Material and Coating The heat sink is made of **Aluminum**, which offers a balance of lightweight properties and high thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides: * Corrosion resistance. * Electrical insulation to a certain degree. * Enhanced emissivity, slightly improving heat radiation. #### C. Thermal Interface Material (TIM) The **T766** pre-applied material ensures that microscopic air gaps between the component surface and the heat sink base are filled, significantly reducing thermal resistance at the contact point. --- ### 3. Performance Characteristics The thermal performance of this heat sink is dependent on the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 11.55 | | **300 (1.5 m/s)** | 4.84 | | **500 (2.5 m/s)** | 3.59 | --- ### 4. Applications This specific model is typically used in: * **Embedded Systems:** Industrial PCs and routers. * **Power Electronics:** Cooling MOSFETs and power modules. * **Networking Hardware:** High-speed switches and telecommunications gear.