The **ATS-P2-101-C3-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to the **pushPIN™** series. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. Technical Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-P2-101-C3-R0 | | **Material** | Aluminum | | **Finish** | Red Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pegs) | | **Thermal Resistance** | 6.77°C/W (at 100 LFM) to 1.30°C/W (at 700 LFM) | | **Dimensions** | 45.00mm x 45.00mm x 30.00mm | --- ### 2. Physical Design and Cooling Performance The design of this heat sink is optimized for both **passive** and **active** cooling environments: * **Fin Type:** It features a **Straight Fin** pattern. This design is highly effective when there is a consistent directional airflow (forced convection) within the electronic enclosure. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or grease, ensuring a high-quality thermal bond between the electronic chip (CPU, FPGA, or MOSFET) and the aluminum base. * **Pressure Distribution:** The pushPIN™ mechanism uses a precise compression spring. This ensures that the heat sink applies even pressure across the component, preventing air gaps that could lead to localized overheating. --- ### 3. Electronic Applications This part is commonly found in medium-to-high power electronic assemblies where heat dissipation is critical for component longevity: 1. **High-Speed Processors:** Used on CPUs or GPUs in embedded systems. 2. **Power Electronics:** Cooling for large VRMs (Voltage Regulator Modules) or Power Transistors. 3. **Telecommunications:** Used on ASICs and FPGAs found in networking switches and routers. 4. **Industrial Controls:** Cooling for motor drivers and power supply units (PSUs). --- ### 4. Installation Reference The "pushPIN" system is designed for quick assembly onto a Printed Circuit Board (PCB). ```markdown 1. Align the pushPINs with the pre-drilled holes in the PCB. 2. Push down until the spring-loaded mechanism "clicks" or locks into place. 3. The integrated spring provides the necessary downward force for optimal thermal transfer. ``` ---