The **ATS-P2-111-C2-R1** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 35mm x 35mm x 30mm | | **Thermal Resistance** | 2.67° C/W (@ 200 LFM) | | **Fin Pattern** | XC-Cut (Cross-Cut) | --- ## 2. Key Electronic Components & Features ### A. The Heat Sink Body (XC-Cut Design) The "XC-Cut" refers to the cross-cut fin geometry. This is critical for electronic enclosures where airflow direction may not be consistent. * **Omnidirectional Airflow:** Unlike straight-fin heat sinks, the cross-cut design allows air to enter from multiple angles, improving cooling efficiency in crowded PCB layouts. * **Surface Area:** The 30mm height provides a large surface area for heat transfer to the ambient air. ### B. Attachment Mechanism (Push-Pin & Spring) The part utilizes a mechanical attachment system rather than thermal adhesive: * **Push-Pins:** Made of brass with a plastic tip that snaps into pre-drilled holes (3.0mm) on the PCB. * **Springs:** Provides a precise, "Firm-Force" pressure (approximately 20psi) to ensure optimal contact between the heat sink and the electronic chip. This prevents the heat sink from shifting during mechanical shock or vibration. ### C. Thermal Interface Material (TIM) The "R1" suffix typically indicates that the part comes with a pre-applied **Phase Change Material** or thermal pad. * **Function:** This fills microscopic air gaps between the component die and the aluminum base, significantly reducing thermal resistance. --- ## 3. Application Use Cases This specific part is commonly found in the following electronic systems: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Computing:** Industrial motherboards and single-board computers (SBCs). 3. **Power Electronics:** Cooling for voltage regulator modules (VRMs).