The **ATS-P2-113-C3-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 1.19°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Style** | Straight Fin | --- ### Key Electronic & Physical Components #### 1. Push-Pin Attachment Mechanism The "P2" in the part number refers to the specific attachment style. It uses a **plastic push-pin** with a compression spring. * **Purpose:** Ensures consistent pressure between the heat sink and the electronic chip (IC). * **Reliability:** The spring-loaded mechanism compensates for thermal expansion and contraction during operation. #### 2. Thermal Interface Material (TIM) The "C3" designation indicates that the heat sink comes pre-applied with a specific **Thermal Interface Material**. * **Function:** It fills microscopic air gaps between the flat bottom of the heat sink and the top of the electronic component to maximize heat transfer. #### 3. Aluminum Fin Array The heat sink features a **straight fin** design. * **Surface Area:** The fins increase the surface area exposed to the air. * **Airflow:** Designed for "forced air" environments (where a fan is present). At 200 LFM (Linear Feet per Minute), it provides a low thermal resistance of 1.19°C/W. --- ### Part Number Breakdown (Nomenclature) To understand this part in the context of electronic design, it helps to decode the suffix: * **ATS:** Advanced Thermal Solutions (Brand). * **P2:** Push-pin type (Plastic pin with specific spring tension). * **113:** Specific model/size code (40x40x10mm). * **C3:** T766 Thermal Interface Material (Pre-applied). * **R0:** Revision code/Standard packaging. --- ### Application in Electronics This part is typically found in: 1. **Networking Hardware:** Cooling ASICs in switches and routers. 2. **Embedded Systems:** Industrial PCs where vertical space is limited (only 10mm tall). 3. **Power Supplies:** Cooling voltage regulators or power MOSFETs.