The **ATS-P2-24-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) and other electronic components to prevent thermal throttling or hardware failure. --- ### 1. Key Technical Specifications | Parameter | Specification | Details | |:---|:---|:---| | **Manufacturer** | Advanced Thermal Solutions | Model series: pushPIN™ | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Corrosion resistance and aesthetic finish | | **Thermal Resistance** | 5.88° C/W | At a flow rate of 100 LFM (Linear Feet per Minute) | | **Dimensions** | 25mm x 25mm | Square footprint | | **Height** | 15.00 mm | Low-to-medium profile | | **Attachment Method** | Push-Pin | Secure mechanical fastening | --- ### 2. Physical Design and Construction #### Fin Configuration The "P2" in the part number refers to a **Straight Fin** or **high-performance** fin pattern. These fins are designed to maximize surface area while allowing air to flow through the channels efficiently. The density of the fins is optimized for both natural and forced convection environments. #### Thermal Interface Material (TIM) This specific model usually comes with **T412** thermal interface material pre-applied to the base. This ensures there are no air gaps between the heat source (the CPU or GPU) and the heat sink, facilitating better heat transfer. --- ### 3. Attachment Mechanism (pushPIN™) The "R0" at the end of the part number indicates the specific mounting hardware. The pushPIN™ system uses: * **Brass or Plastic Pins:** To secure the heat sink to the PCB. * **Compression Springs:** These provide precisely calculated pressure (constant force) to ensure the heat sink remains in contact with the component during thermal expansion or vibration. --- ### 4. Electronic Applications This part is commonly found in the following electronic environments: * **Telecommunications:** Networking switches and routers. * **Industrial PC:** Cooling small form-factor processors. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Protecting microcontrollers in high-temperature industrial settings. ---