The **ATS-P2-87-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to optimize airflow and heat dissipation for electronic components like BGAs (Ball Grid Arrays). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 13.12°C/W (at 100 LFM) | | **Dimensions (L x W)** | 36.83mm x 36.83mm | | **Height (Fin Height)** | 12.70mm | | **Thermal Interface Material (TIM)** | ATS-51 (Pre-applied) | --- ### 2. Key Electronic Components & Design Features The "electronic" functionality of this part is passive, meaning it does not require power but is critical for the survival of active semiconductors. * **maxiFLOW™ Geometry:** The fins are designed with a graduated pattern. This reduces pressure drop and increases the surface area exposed to moving air, which is essential for densely packed PCBs. * **pushPIN™ Attachment:** This is a mechanical mounting system. It uses a flexible spring-loaded pin to ensure consistent pressure (clamping force) between the heat sink and the chip, which maximizes heat transfer through the TIM. * **ATS-51 TIM:** The base comes with a pre-applied Phase Change Material. When the electronic chip heats up, this material softens to fill microscopic air gaps between the chip surface and the aluminum, drastically reducing thermal impedance. --- ### 3. Applications This specific heat sink is typically found in the following electronic environments: * **Telecommunications:** Cooling for high-speed routers and switches. * **Computing:** Protecting CPUs, GPUs, or high-performance FPGAs. * **Power Electronics:** Dissipating heat from MOSFETs or power converters in compact enclosures. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **P2** | pushPIN™ Attachment Series | | **87** | Specific footprint/dimension code | | **C1** | Material/Finish (Aluminum / Black Anodized) | | **R0** | Revision/Packaging code |