H.FL-R-SMT
AI

The **H.FL-R-SMT** is a high-frequency, ultra-small surface-mount coaxial connector developed by **Hirose Electric**. It is widely used in compact wireless devices for RF (Radio Frequency) signal transmission.
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### 1. Technical Specifications
The H.FL series is known for its low profile and high performance-to-size ratio.
| Feature | Specification |
| :--- | :--- |
| **Connector Type** | Receptacle (Male pin, Female body) |
| **Mounting Type** | SMT (Surface Mount Technology) |
| **Frequency Range** | DC up to 3 GHz |
| **Characteristic Impedance** | 50 Ohms |
| **V.S.W.R.** | 1.3 Max (DC to 3 GHz) |
| **Mated Height** | 3.0 mm (when used with H.FL plug) |
| **Operating Temperature** | -40°C to +85°C |
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### 2. Key Components and Materials
The "H.FL-R-SMT" is composed of three primary electronic material zones:
1. **Center Contact:** Usually made of phosphor bronze with **gold plating**. This ensures high conductivity and prevents oxidation at high frequencies.
2. **Insulator:** Made of high-temperature liquid crystal polymer (LCP) or similar resin to withstand reflow soldering temperatures.
3. **Outer Shell/Ground:** Made of silver-plated or gold-plated phosphor bronze to provide excellent EMI (Electromagnetic Interference) shielding.
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### 3. Applications
Due to its small footprint and 50-ohm impedance matching, it is commonly found in:
* **Mobile Phones:** Connecting the internal PCB to the antenna.
* **Wireless Modules:** Wi-Fi, Bluetooth, and GPS modules.
* **IoT Devices:** Compact sensors requiring external antenna connectivity.
* **Measuring Instruments:** Compact RF testing boards.
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### 4. Comparison with Similar Connectors
The H.FL is part of a lineage of Hirose connectors. It is slightly larger than the ubiquitous U.FL connector but offers different mechanical stability.
| Series | Mated Height | Frequency |
| :--- | :--- | :--- |
| **U.FL** | 1.9mm - 2.4mm | Up to 6 GHz |
| **H.FL** | 3.0mm | Up to 3 GHz |
| **W.FL** | 1.4mm | Up to 6 GHz |
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### 5. Footprint Example (Generic SMT)
When designing a PCB for this part, the landing pattern typically looks like this in a CAD environment:
```gcode
(Simplified Pad Layout)
[ G ] [ S ] [ G ]
| | |
+------+------+
(Ground Plane)
```
* **S:** Signal Pad (Center pin)
* **G:** Ground Pads (Outer shell anchors)
- ⤷
What are the main differences between H.FL and U.FL connectors in terms of durability?
- ⤷ How do I calculate the trace width for a 50-ohm H.FL-R-SMT connection on a 4-layer PCB?
- ⤷ Can the H.FL-R-SMT handle frequencies higher than 3 GHz in non-standard conditions?