The **M2AS1-A423-R2/N** is a specific part number typically associated with high-density, small-form-factor **DDR4 Memory Modules**, specifically designed for embedded systems, industrial computing, or server networking equipment. Below is a breakdown of the electronic specifications and characteristics of this component. --- ### 1. Technical Specifications This part is generally a **VLP-RDIMM** (Very Low Profile Registered DIMM). The "VLP" designation is critical for blade servers or 1U chassis where airflow and space are restricted. | Feature | Specification | | :--- | :--- | | **Memory Type** | DDR4 SDRAM | | **Form Factor** | 288-pin VLP-RDIMM | | **Capacity** | 4GB / 8GB (Varies by revision, usually 4GB for this code) | | **Speed** | 2133 MT/s or 2400 MT/s | | **Voltage** | 1.2V (Low Power) | | **Error Correction** | ECC (Error Correcting Code) | | **Rank** | Single Rank (1Rx8) | --- ### 2. Key Component Parts The module is comprised of several distinct electronic sections: #### A. DRAM Integrated Circuits (ICs) The core of the module consists of synchronous dynamic random-access memory chips. These chips use a "Fly-by" topology for command, address, and control signals to improve signal integrity. #### B. Registering Clock Driver (RCD) As an **RDIMM**, it includes a buffer chip (the Register). * **Function:** It buffers the address and control signals from the memory controller. * **Benefit:** Reduces the electrical load on the system memory controller, allowing for higher stability and capacity. #### C. Serial Presence Detect (SPD) EEPROM A small non-volatile chip located on the PCB. * **Function:** It stores the timing parameters, manufacturer data, and serial numbers. * **Protocol:** Communicates with the motherboard via the $I^2C$ bus. #### D. Thermal Sensor The "/N" variant often includes an integrated thermal sensor. * **Purpose:** Monitors the temperature of the module in real-time to trigger thermal throttling if the hardware exceeds safe operating limits. --- ### 3. Physical Attributes * **VLP Design:** The height is approximately **18.75mm**, compared to the standard 31.25mm. * **Gold Fingers:** 288 gold-plated contacts for high-frequency data transmission and corrosion resistance. * **Multi-layer PCB:** Typically an 8-layer or 10-layer PCB to minimize electromagnetic interference (EMI). --- ### 4. Application Use-Case | Environment | Reason for Use | | :--- | :--- | | **1U Servers** | Fits in horizontal slots without blocking airflow. | | **Industrial PC** | ECC support ensures data integrity in critical environments. | | **Networking Gear** | Used in high-speed routers and switches requiring buffered memory. |