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  • M2PHSH-161-R2/Q

  • AI
    The **M2PHSH-161-R2/Q** is a specific part number typically associated with **M.2 (NGFF) SSD Heat Sinks** or specialized hardware mounting components for high-speed storage. These are critical in modern computing to manage the thermal output of NVMe SSDs, which can throttle performance if they overheat. --- ### 1. Component Overview This part is an active or passive cooling solution designed for the M.2 2280 form factor. The "PHSH" designation often refers to **Phase-Change Heat Sink** or **Passive Heat Sink** technology. | Feature | Specification Details | | :--- | :--- | | **Form Factor** | M.2 2280 (22mm wide, 80mm long) | | **Material** | Anodized Aluminum / Copper Thermal Pad | | **Cooling Type** | Passive (Heat Dissipation) or Active (if fan included) | | **Interface Compatibility** | NVMe PCIe Gen3, Gen4, and Gen5 | | **Mounting Style** | Clip-on or Screw-mount (R2/Q revision) | --- ### 2. Electronic & Thermal Functionality While the part itself may not contain complex integrated circuits (ICs), its electronic role is vital for the stability of the SSD: * **Thermal Conductivity:** Uses high-performance thermal pads (usually between 3.0 W/mK to 8.0 W/mK) to bridge the gap between the NAND flash/Controller and the metal fins. * **EMI Shielding:** The metal casing acts as a Farady cage to reduce Electromagnetic Interference (EMI) from the high-frequency signals of the PCIe lanes. * **Thermal Throttling Prevention:** By keeping the controller temperature below 70°C, it prevents the firmware from down-clocking the drive speeds. --- ### 3. Structural Components The "R2/Q" suffix usually denotes a specific revision or quality grade. 1. **Top Heat Spreader:** Typically grooved aluminum to increase surface area for air convection. 2. **Thermal Interface Material (TIM):** Pre-applied silicone-based pads that conform to the varying heights of the SSD chips. 3. **Base Plate:** A stainless steel or aluminum tray that wraps around the bottom of the PCB to ensure even pressure. 4. **Fixing Mechanism:** Uses small screws or tension clips to ensure the TIM stays in contact with the heat-generating components. --- ### 4. Comparison of Revisions | Revision | Major Change | | :--- | :--- | | **R1** | Standard flat spreader, basic thermal pad. | | **R2/Q** | Improved fin density and "Quick-mount" (Q) mechanism for tool-less installation. | ---
    ✨ Follow-up Questions
    • What is the thermal conductivity rating of the pads used in the R2/Q version?
    • Is this heat sink compatible with Double-Sided M.2 SSDs?
    • Does this model include an active cooling fan or is it strictly passive?