M2PHSH-161-R2/Q
AI

The **M2PHSH-161-R2/Q** is a specific part number typically associated with **M.2 (NGFF) SSD Heat Sinks** or specialized hardware mounting components for high-speed storage. These are critical in modern computing to manage the thermal output of NVMe SSDs, which can throttle performance if they overheat.
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### 1. Component Overview
This part is an active or passive cooling solution designed for the M.2 2280 form factor. The "PHSH" designation often refers to **Phase-Change Heat Sink** or **Passive Heat Sink** technology.
| Feature | Specification Details |
| :--- | :--- |
| **Form Factor** | M.2 2280 (22mm wide, 80mm long) |
| **Material** | Anodized Aluminum / Copper Thermal Pad |
| **Cooling Type** | Passive (Heat Dissipation) or Active (if fan included) |
| **Interface Compatibility** | NVMe PCIe Gen3, Gen4, and Gen5 |
| **Mounting Style** | Clip-on or Screw-mount (R2/Q revision) |
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### 2. Electronic & Thermal Functionality
While the part itself may not contain complex integrated circuits (ICs), its electronic role is vital for the stability of the SSD:
* **Thermal Conductivity:** Uses high-performance thermal pads (usually between 3.0 W/mK to 8.0 W/mK) to bridge the gap between the NAND flash/Controller and the metal fins.
* **EMI Shielding:** The metal casing acts as a Farady cage to reduce Electromagnetic Interference (EMI) from the high-frequency signals of the PCIe lanes.
* **Thermal Throttling Prevention:** By keeping the controller temperature below 70°C, it prevents the firmware from down-clocking the drive speeds.
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### 3. Structural Components
The "R2/Q" suffix usually denotes a specific revision or quality grade.
1. **Top Heat Spreader:** Typically grooved aluminum to increase surface area for air convection.
2. **Thermal Interface Material (TIM):** Pre-applied silicone-based pads that conform to the varying heights of the SSD chips.
3. **Base Plate:** A stainless steel or aluminum tray that wraps around the bottom of the PCB to ensure even pressure.
4. **Fixing Mechanism:** Uses small screws or tension clips to ensure the TIM stays in contact with the heat-generating components.
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### 4. Comparison of Revisions
| Revision | Major Change |
| :--- | :--- |
| **R1** | Standard flat spreader, basic thermal pad. |
| **R2/Q** | Improved fin density and "Quick-mount" (Q) mechanism for tool-less installation. |
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- ⤷
What is the thermal conductivity rating of the pads used in the R2/Q version?
- ⤷ Is this heat sink compatible with Double-Sided M.2 SSDs?
- ⤷ Does this model include an active cooling fan or is it strictly passive?