The **M2SBS-312-R2** is a specific technical part number, primarily associated with high-performance **M.2 SSD Thermal Solutions (Heat Sinks)** or mounting hardware used in enterprise and industrial computing environments. Below is an overview of its electronic and mechanical specifications. --- ## 1. Component Overview The M2SBS series generally refers to **M.2 SSD Heat Sinks** designed to manage the thermal output of NVMe storage devices. The "-312" typically denotes the height or specific Revision 2 (R2) design adjustments for airflow efficiency. | Feature | Specification | | :--- | :--- | | **Component Type** | Passive Thermal Management (Heat Sink) | | **Supported Form Factor** | M.2 2280 (22mm x 80mm) | | **Material** | Extruded Aluminum (Al6063-T5) | | **Interface Material** | High-conductivity Thermal Pad (Pre-applied) | | **Fastening Method** | Spring Clips or Screw-mount | --- ## 2. Key Electronic & Physical Attributes ### Thermal Dissipation The primary electronic role of this part is to prevent **Thermal Throttling** in high-speed SSDs. * **Thermal Conductivity:** The aluminum body typically provides ~200 W/m·K. * **Cooling Efficiency:** Can reduce controller temperatures by 10°C to 25°C depending on chassis airflow. ### Mechanical Dimensions The R2 version is often optimized for low-profile environments (such as 1U servers or compact motherboards). * **Height:** Typically 3mm to 12mm (depending on the specific sub-series). * **Clearance:** Designed to avoid interference with adjacent PCIe slots or CPU coolers. ### Thermal Interface Material (TIM) The part includes a non-conductive thermal pad. * **Dielectric Strength:** Ensures that even if the pad touches surface-mount components (SMD) on the M.2 PCB, it will not cause a short circuit. * **Compressibility:** Allows the heat sink to make contact with both the controller and the NAND flash chips despite height variances. --- ## 3. Installation Compatibility The "R2" revision usually implies improved compatibility with: 1. **Double-Sided M.2s:** Design changes to accommodate chips on both sides of the PCB. 2. **Spring Clip Tension:** Refined pressure to ensure the M.2 card does not bend under thermal expansion. ---