The **M2UDS-B0-R/N** is a specific electronic component typically categorized under **Interconnects** or **Memory/Expansion Card Connectors**. Specifically, it is a connector designed for **M.2 (Next Generation Form Factor - NGFF)** modules. Below is a detailed breakdown of its technical specifications and electronic characteristics. --- ### 1. General Specifications The M2UDS series is designed for high-speed data transmission in compact devices like laptops, NUCs, and industrial PCs. | Feature | Specification | | :--- | :--- | | **Connector Type** | M.2 (NGFF) Card Edge Connector | | **Orientation** | Right Angle / Horizontal | | **Mounting Type** | Surface Mount (SMT) | | **Number of Positions** | 67 Pins | | **Pitch** | 0.50 mm | | **Keying** | Typically B-Key or M-Key (check specific suffix) | --- ### 2. Key Electronic Characteristics These parts are engineered to handle high-frequency signals with minimal interference. * **Current Rating:** Generally 0.5A per pin. * **Voltage Rating:** 50V AC/DC. * **Contact Resistance:** Typically 55mΩ maximum (initial). * **Insulation Resistance:** 500MΩ minimum. * **Dielectric Withstanding Voltage:** 300V AC for 1 minute. * **Data Rates:** Designed to support PCIe Gen 3/Gen 4, SATA 3.0, and USB 3.0 protocols. --- ### 3. Material Composition The "R/N" suffix often refers to the packaging or specific material compliance (like RoHS or Halogen-Free). * **Housing:** High-temperature thermoplastic (LCP), UL94V-0 rated (suitable for reflow soldering). * **Contacts:** Copper Alloy with Gold plating (to prevent oxidation and ensure high conductivity). * **Solder Tabs:** Stainless steel or copper alloy with Tin plating for mechanical stability on the PCB. --- ### 4. Part Number Suffix Breakdown While nomenclature varies by manufacturer (such as **UDO** or **Acon**), the suffix usually indicates: * **-B0:** Revision code or specific height (e.g., 3.2mm or 4.2mm profile). * **-R:** Usually stands for **Tape & Reel** packaging (for automated pick-and-place). * **-N:** Often signifies **Halogen-Free** or a specific plating variant. --- ### 5. Common Applications * **Storage:** Connecting NVMe or SATA M.2 SSDs. * **Connectivity:** Wi-Fi, Bluetooth, or WWAN (LTE/5G) modules. * **IoT:** Compact gateways and edge computing boards.