The **M93C76-RBN3TP/S** is an 8-Kbit serial MICROWIRE EEPROM (Electrically Erasable Programmable Read-Only Memory) manufactured by STMicroelectronics. It is designed for low-power applications and is commonly used for storing configuration data, calibration constants, and device IDs. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Memory Size** | 8 Kbit (8192 bits) | | **Memory Organization** | 512 x 16-bit or 1024 x 8-bit (Selectable) | | **Interface** | MICROWIRE (3-wire serial) | | **Operating Voltage (Vcc)** | 1.8V to 5.5V | | **Clock Frequency** | 2 MHz (at 4.5V - 5.5V) | | **Operating Temperature** | -40°C to +125°C (Grade 3) | | **Package Type** | SOT23-5 | | **Endurance** | 4 million write cycles | | **Data Retention** | 200 years | --- ## Key Features ### 1. Memory Organization (ORG Pin) The device is "user-configurable." Depending on the state of the Organization (ORG) pin: * **ORG at Vcc:** The memory is organized as **512 words of 16 bits**. * **ORG at GND:** The memory is organized as **1024 bytes of 8 bits**. ### 2. The MICROWIRE Interface This is a synchronous serial communication protocol. It uses four signals: * **S (Chip Select):** Activates the device. * **D (Serial Data Input):** For opcodes, addresses, and data. * **Q (Serial Data Output):** For reading data or status bits. * **C (Serial Clock):** Synchronizes data transfer. ### 3. Write Protection and Reliability * **Write Enable/Disable:** The device includes specific instructions (`WEN` and `WDS`) to prevent accidental data erasure or overwriting. * **Ready/Busy Signal:** During a write cycle, the `Q` pin can be polled to check if the internal write operation is complete. --- ## Decoding the Part Number: M93C76-RBN3TP/S | Segment | Meaning | | :--- | :--- | | **M93** | MICROWIRE Interface Family | | **C76** | 8-Kbit Density | | **-R** | Voltage range: 1.8V to 5.5V | | **BN** | Plastic SOT23 package | | **3** | Temperature range: -40°C to +125°C | | **TP** | Tape & Reel packaging | | **/S** | Refers to a specific manufacturing process or shrink version | --- ## Application Circuits When integrating this part, follow these standard practices: * **Decoupling:** Place a **0.1µF capacitor** between Vcc and GND as close to the chip as possible to filter power supply noise. * **Pull-up/down Resistors:** Ensure the Chip Select (S) line has a pull-down resistor to keep the device inactive during the microcontroller's power-up phase.