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Hello, Please ask a question about MPC8260EC Datasheet
# Example questions:
➢ What is a key consideration when calculating power dissipation on input/output pins (p i/o)?
➢ Identify the variables used in this formula and briefly explain what each represents.
➢ What is the typical value for θja (package thermal resistance, junction to ambient) when using the tbga package with a 1 m/s airflow?
| Part No. | MPC8260EC |
| Manufacturer | FREESCALE |
| Size | 754 Kbytes |
| Pages | 41 pages |
| Description | PowerQUICC II Integrated Communications Processor Hardware Specifications |
1. Device Overview:
️· This is documentation for the MPC8260 PowerQUICC II Integrated Communications Processor.
2. Electrical Characteristics:
️· Input Voltages:
- VIH (standard inputs): 2.0 - 3.465V
- VIL (standard inputs): GND - 0.8V
- VIHC (CLKIN): 2.4 - 3.465V
- VILC (CLKIN): GND - 0.4V
️· Input/Output Currents: Ranges specified for various pin types (e.g., data pins, control pins) including:
- IIN (Input Leakage Current): Max 10 µA
- IOZ (Hi-Z Leakage Current): Max 10 µA
- Output High Voltage (VOH): Ranges specified depending on the pin type; important to note differences for UTOPIA mode.
- Output Low Voltage (VOL): Ranges specified depending on pin type; important to note differences for UTOPIA mode.
️· Pin Configuration Notes: Unused pins should be driven to GND or VDDH or configured as outputs to prevent excessive DC current.
️· Revision Note: Rev C.2 silicon have slightly different specifications.
3. Thermal Characteristics:
️· Thermal Resistance (θJA): Ranges specified for TBGA package, varying with airflow.
- Natural Convection (NC): Around 13.071 °C/W
- Forced Airflow: Values ranging from 7.783°C/W to 9.551°C/W.
️· Thermal Calculations: Formulas provided to estimate junction temperature (T<sub>J</sub>) based on ambient temperature (T<sub>A</sub>), power dissipation (P<sub>D</sub>), and thermal resistance (θ<sub>JA</sub>).
- T<sub>J</sub> = T<sub>A</sub> + (P<sub>D</sub> x θ<sub>JA</sub>)
- P<sub>D</sub> = P<sub>INT</sub> + P<sub>I/O</sub> (where P<sub>INT</sub> is internal power and P<sub>I/O</sub> is power dissipation on input/output pins)
1. Device Overview:
️· This is documentation for the MPC8260 PowerQUICC II Integrated Communications Processor.
2. Electrical Characteristics:
️· Input Voltages:
- VIH (standard inputs): 2.0 - 3.465V
- VIL (standard inputs): GND - 0.8V
- VIHC (CLKIN): 2.4 - 3.465V
- VILC (CLKIN): GND - 0.4V
️· Input/Output Currents: Ranges specified for various pin types (e.g., data pins, control pins) including:
- IIN (Input Leakage Current): Max 10 µA
- IOZ (Hi-Z Leakage Current): Max 10 µA
- Output High Voltage (VOH): Ranges specified depending on the pin type; important to note differences for UTOPIA mode.
- Output Low Voltage (VOL): Ranges specified depending on pin type; important to note differences for UTOPIA mode.
️· Pin Configuration Notes: Unused pins should be driven to GND or VDDH or configured as outputs to prevent excessive DC current.
️· Revision Note: Rev C.2 silicon have slightly different specifications.
3. Thermal Characteristics:
️· Thermal Resistance (θJA): Ranges specified for TBGA package, varying with airflow.
- Natural Convection (NC): Around 13.071 °C/W
- Forced Airflow: Values ranging from 7.783°C/W to 9.551°C/W.
️· Thermal Calculations: Formulas provided to estimate junction temperature (T<sub>J</sub>) based on ambient temperature (T<sub>A</sub>), power dissipation (P<sub>D</sub>), and thermal resistance (θ<sub>JA</sub>).
- T<sub>J</sub> = T<sub>A</sub> + (P<sub>D</sub> x θ<sub>JA</sub>)
- P<sub>D</sub> = P<sub>INT</sub> + P<sub>I/O</sub> (where P<sub>INT</sub> is internal power and P<sub>I/O</sub> is power dissipation on input/output pins)
| Part No. | MPC8260EC |
| Manufacturer | FREESCALE |
| Size | 754 Kbytes |
| Pages | 41 pages |
| Description | PowerQUICC II Integrated Communications Processor Hardware Specifications |
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