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Hello, Please ask a question about SN74LS393D Datasheet
# Example questions:
➢ What is the value of 'he' (the package height) for the soic package, both in millimeters and inches?
➢ What are the minimum and maximum values for the lead width dimension 'b' in the soic package?
➢ What is the maximum allowable protrusion for mold flash?
1. Overview: What is this Document?
This document provides technical specifications, particularly dimensional information, for different package types of the SN74LS161 (Quad 8-bit Binary Counter). It appears to be a datasheet or similar document for engineers and manufacturers.
2. Package Types & Key Dimensional Information
The document describes the following package types. I'm extracting the key dimensions where available from the various tables. Note that dimensions are given in millimeters (mm) *and* inches. The first dimension is MIN, the second is MAX.
️· CERDIP (Ceramic DIP): This is likely an older style.
- Overall Length: 18.30 mm (0.720 in)
- Lead Length: 7.62 mm (0.300 in)
- Lead Spacing: 2.54mm (0.100 in)
- Body Width: 9.53 mm (0.375 in)
- Body Height: 3.30 mm (0.130 in)
️· PDIP (Plastic DIP): A more common DIP style.
- Overall Length: 19.05 mm (0.750 in)
- Lead Length: 7.62 mm (0.300 in)
- Lead Spacing: 2.54mm (0.100 in)
- Body Width: 9.53 mm (0.375 in)
- Body Height: 3.30 mm (0.130 in)
️· SOIC (Small Outline Integrated Circuit): A surface mount package.
- Overall Length: 8.66 mm (0.341 in)
- Lead Length: 1.27 mm (0.050 in)
- Body Width: 3.18 mm (0.125 in)
- Body Height: 3.91 mm (0.154 in)
️· DIE (Bare Die): This is the silicon chip itself, without packaging. Dimensions are variable, as they depend on the design and manufacturing process.
️· SOL (Small Outline):
- Overall Length: 9.78 mm (0.385)
- Body Width: 3.91mm (0.154)
- Body Height: 3.91 mm (0.154)
️· WSON (Wafer Level System in Package):
- Overall Length: 2.93 mm (0.115 in)
- Body Width: 2.93 mm (0.115)
- Body Height: 0.91mm (0.036)
3. Key Notes and Callouts (Based on the Documentation):
️· Lead Dimensions: Lead lengths and spacing are crucial for PCB layout and soldering.
️· Body Dimensions: Width and height affect the chip's fit within a circuit board or enclosure.
️· Die Dimensions: Highly variable and not standardized. These are for specialized applications or assembly.
️· "DETAIL P": Likely refers to a drawing showing the lead width and "dam bar protrusion" specifications, which are critical for reliable soldering.
️· Dam Bar Protrusion: A small, controlled protrusion on the leads during the molding process to aid in wire attachment. The document specifies allowable dimensions for this protrusion.
️· Overall Length: the measurement from the end of one lead to the end of the other lead.
In essence, this document is a detailed engineering guide for designing and manufacturing circuits and devices that incorporate the SN74LS161 Quad 8-bit Binary Counter. The included tables and notes are crucial for ensuring proper fit, electrical connection, and reliability.
1. Overview: What is this Document?
This document provides technical specifications, particularly dimensional information, for different package types of the SN74LS161 (Quad 8-bit Binary Counter). It appears to be a datasheet or similar document for engineers and manufacturers.
2. Package Types & Key Dimensional Information
The document describes the following package types. I'm extracting the key dimensions where available from the various tables. Note that dimensions are given in millimeters (mm) *and* inches. The first dimension is MIN, the second is MAX.
️· CERDIP (Ceramic DIP): This is likely an older style.
- Overall Length: 18.30 mm (0.720 in)
- Lead Length: 7.62 mm (0.300 in)
- Lead Spacing: 2.54mm (0.100 in)
- Body Width: 9.53 mm (0.375 in)
- Body Height: 3.30 mm (0.130 in)
️· PDIP (Plastic DIP): A more common DIP style.
- Overall Length: 19.05 mm (0.750 in)
- Lead Length: 7.62 mm (0.300 in)
- Lead Spacing: 2.54mm (0.100 in)
- Body Width: 9.53 mm (0.375 in)
- Body Height: 3.30 mm (0.130 in)
️· SOIC (Small Outline Integrated Circuit): A surface mount package.
- Overall Length: 8.66 mm (0.341 in)
- Lead Length: 1.27 mm (0.050 in)
- Body Width: 3.18 mm (0.125 in)
- Body Height: 3.91 mm (0.154 in)
️· DIE (Bare Die): This is the silicon chip itself, without packaging. Dimensions are variable, as they depend on the design and manufacturing process.
️· SOL (Small Outline):
- Overall Length: 9.78 mm (0.385)
- Body Width: 3.91mm (0.154)
- Body Height: 3.91 mm (0.154)
️· WSON (Wafer Level System in Package):
- Overall Length: 2.93 mm (0.115 in)
- Body Width: 2.93 mm (0.115)
- Body Height: 0.91mm (0.036)
3. Key Notes and Callouts (Based on the Documentation):
️· Lead Dimensions: Lead lengths and spacing are crucial for PCB layout and soldering.
️· Body Dimensions: Width and height affect the chip's fit within a circuit board or enclosure.
️· Die Dimensions: Highly variable and not standardized. These are for specialized applications or assembly.
️· "DETAIL P": Likely refers to a drawing showing the lead width and "dam bar protrusion" specifications, which are critical for reliable soldering.
️· Dam Bar Protrusion: A small, controlled protrusion on the leads during the molding process to aid in wire attachment. The document specifies allowable dimensions for this protrusion.
️· Overall Length: the measurement from the end of one lead to the end of the other lead.
In essence, this document is a detailed engineering guide for designing and manufacturing circuits and devices that incorporate the SN74LS161 Quad 8-bit Binary Counter. The included tables and notes are crucial for ensuring proper fit, electrical connection, and reliability.
| Part No. | SN74LS393D |
| Manufacturer | ONSEMI |
| Size | 217 Kbytes |
| Pages | 8 pages |
| Description | Dual 4?뭆tage Binary Counter |
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