FEATURES
• Plated or filled via technology
• Mulitlayer and overcoat patterning
• Lumped element custom substrates
• Al2O3, AlN, and BeO substrate drilling and shaping
• TaN and NiCr resistor films
• Metallization on 1,2, or 4 surfaces
• Various substrate materials
• Sputtered / plated metal systems
• Custom sizes from 0.020" x 0.020" to 4.000" x 4.000"
• Quick delivery available

APPLICATIONS
Vishay EFI custom interconnect substrates are used in military, aerospace, hybrid circuit, telecommunications, microwave, and
industrial applications. These custom interconnect substrates are manufactured to be used in heat transfer connectors, top to
bottom connectors, and RF / microwave designs. Surface connections can be made by plated thru-holes, edge wraps, or filled
via technologies. Custom cutouts of various sizes and shapes can also be created and used to fit into almost any size and
shape. The custom interconnect substrates are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment
and manufacturing technology. The custom interconnect substrates are 100 % electrically tested (when applicable) and visually
inspected to MIL-STD-883, method 2032 class H or K.