Features
• AQG 324 qualified
• Half-bridge power module
• 650 V blocking voltage
• Fast recovery body diode
• Very low switching energies
• Low package inductance
• Dice on direct bond copper (DBC) substrate
• Low thermal resistance
• Isolation rating of 3.4 kVrms/min

Description
This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT
is a very compact and rugged power module in a surface mount package for easy
assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low
thermal resistance coupled with an isolated top-side thermal pad. The high design
flexibility of the package enables several configurations, including phase legs, boost,
and single switch through different combinations of the internal power switches.