Features
 RDS(ON), VGS@10V, ID@10A<5.5mΩ
 RDS(ON), VGS@4.5V, ID@5A<7.5mΩ
 High switching speed
 Improved dv/dt capability
 Low Gate Charge
 Low reverse transfer capacitance
 Lead free in compliance with EU RoHS 2.0
 Green molding compound as per IEC 61249 standard
Mechanical Data
 Case : SOP-8 package
 Terminals : Solderable per MIL-STD-750, Method 2026
 Approx. Weight : 0.0029 ounces, 0.083 grams