FEATURES
 For surface mounted applications in order to optimize board space
 Typical maximum temperature coefficient △VBR=0.1%xVBR@25°C x△T
 Low profile package
 Built-in strain relief
 Glass passivated junction
 Excellent clamping capability
 Repetition Rate (duty cycle):0.01%
 Fast response time: typically less than 1.0ps from
0 Volts to BV
 Meet MSL1 Level, per J-STD-020, LF maximum peak of 260 ℃
 Plastic package has Underwriters Laboratory
Flammability 94V-0
 Matte Tin Lead-free plated