Features
1. Ultra Low-profile and
Space-saving Design
Compact design ideal for mobile devices.
・ Stacking height : 0.5mm, Pitch : 0.3mm,Depth : 1.7mm
2. Robust Design
Fully armored guides prevent housing damage
due to misalignment when mating.
3. Dimpled Contact Lock Design
for High Extraction Force
Dimpled lock design on power and signal contacts
enables high extraction force.
4. Enhanced PCB Peeling Strength
Both the header and receptacle have 3 solder areas
at each power contact for greater PCB peeling
strength.
5. High Contact Reliability
6. Superior Mating Operability
7. Halogen-Free
Both the power and signal contacts have a two-point
contact design, ensuring high contact reliability.
Wide self-alignment range with metal guides offers
a smooth mating operation.
(±0.29mm in pitch direction, ±0.24mm in width
direction)
Additionally, the clear tactile click generated by the
unique locking contact design ensures complete
mating.
All materials and substances used to produce this
product comply with Halogen-free standards.
* As defined by IEC 61249-2-21
Br : 900ppm max., Cl : 900ppm max.,
Br+Cl : 1,500ppm max.