Features
•Silicone-type spacer with great long term reliability
•Lower thermal resistance than thermal pads
•Physical property between liquid and solid state
•Elimination of different heat source gap & heat sink
•Can be applied with dispenser

Applications
Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile
Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED,
Mother Board,Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device,
Wireless Hub, DDR ll Module, etc.