Feature
SMD type zinc oxide based ceramic chip
Insulator over coat keeps excellent low and stable leakage
current
Plating termination provided good solderability characteristic
Quick response time (<1ns)
Low clamping voltage
High transient current capability
Meet IEC 61000-4-2, 61000-4-4, and 61000-4-5 standard
Compact size for EIA 0201/0402/0603/1206

Application
Suitable for Push-Button, Power Line and Low Frequency single line
over voltage protect.
Applications for Mother Board, Notebook, Cellular Phone, PDA,
handheld device, DSC, DV, Scanner, and Set-Top Box…etc.