Features
● 1/2.7”
● 1600x1400
● 8/10/12-bit
● 2.79 μm
90 fps global shutter with CDS
High sensitivity
Small die size achieved via state-of-the-art stacked
BSI technology
Class leading QE at 940 nm combined with high
sensitivity. Industry leading PLS at 940 nm
Digital CDS and row noise correction
● On chip defect pixel detection and correction
● On chip image statistics generation
Available as Mono, RGB or RGBIR variant.
Orderable with AR coated or plain glass and
protective film
Low power consumption