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MBM29DL32XTE80 데이터시트 (PDF) - SPANSION

MBM29DL32XTE80 Datasheet PDF - SPANSION
부품명 MBM29DL32XTE80
다운로드  MBM29DL32XTE80 다운로드
파일 크기   1278.65 Kbytes
페이지   84 Pages
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홈페이지  http://www.spansion.com
Logo SPANSION - SPANSION
상세설명 FLASH MEMORY CMOS 32 M (4 M X 8/2 M X 16) BIT Dual Operation

MBM29DL32XTE80 Datasheet (PDF)

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MBM29DL32XTE80 Datasheet PDF - SPANSION

부품명 MBM29DL32XTE80
다운로드  MBM29DL32XTE80 Click to download

파일 크기   1278.65 Kbytes
페이지   84 Pages
제조업체  SPANSION [SPANSION]
홈페이지  http://www.spansion.com
Logo SPANSION - SPANSION
상세설명 FLASH MEMORY CMOS 32 M (4 M X 8/2 M X 16) BIT Dual Operation

MBM29DL32XTE80 데이터시트 (HTML) - SPANSION


MBM29DL32XTE80 제품 세부 정보

■ DESCRIPTION
The MBM29DL32XTE/BE are a 32 M-bit, 3.0 V-only Flash memory organized as 4 Mbytes of 8 bits each or 2 Mwords of 16 bits each. These devices are designed to be programmed in-system with the standard system 3.0 V VCC supply. 12.0 V VPP and 5.0 V VCC are not required for write or erase operations. The devices can also be reprogrammed in standard EPROM programmers.

■ FEATURES
• 0.23 µm Process Technology
• Simultaneous Read/Write operations (dual bank)
    Multiple devices available with different bank sizes (Refer to “MBM29DL32XTE/BE Device Bank Divisions” in “■ FEATURES”)
    Host system can program or erase in one bank, then immediately and simultaneously read from the other bank
    Zero latency between read and write operations
    Read-while-erase
    Read-while-program
• Single 3.0 V read, program, and erase
    Minimizes system level power requirements
• Compatible with JEDEC-standard commands
    Uses same software commands as E2PROMs
• Compatible with JEDEC-standard world-wide pinouts
    48-pin TSOP (1) (Package suffix : TN − Normal Bend Type, TR − Reversed Bend Type)
    63-ball FBGA (Package suffix : PBT)
• Minimum 100,000 program/erase cycles
• High performance
    80 ns maximum access time
• Sector erase architecture
    Eight 4 Kword and sixty-three 32 Kword sectors in word mode
    Eight 8 Kbyte and sixty-three 64 Kbyte sectors in byte mode
    Any combination of sectors can be concurrently erased. Also supports full chip erase.
• Boot Code Sector Architecture
    T = Top sector
    B = Bottom sector
• HiddenROM region
    64 Kbyte of HiddenROM, accessible through a new “HiddenROM Enable” command sequence
    Factory serialized and protected to provide a secure electronic serial number (ESN)
• WP/ACC input pin
    At VIL, allows protection of boot sectors, regardless of sector group protection/unprotection status
    At VACC, increases program performance
• Embedded EraseTM Algorithms
    Automatically pre-programs and erases the chip or any sector
• Embedded ProgramTM Algorithms
    Automatically writes and verifies data at specified address
• Data Polling and Toggle Bit feature for detection of program or erase cycle completion
• Ready/Busy output (RY/BY)
    Hardware method for detection of program or erase cycle completion
• Automatic sleep mode
    When addresses remain stable, automatically switch themselves to low power mode.
• Low VCC write inhibit ≤ 2.5 V
• Erase Suspend/Resume
    Suspends the erase operation to allow a read data and/or program in another sector within the same device
• Sector group protection
    Hardware method disables any combination of sector groups from program or erase operations
• Sector Group Protection Set function by Extended sector group protection command
• Fast Programming Function by Extended Command
• Temporary sector group unprotection
    Temporary sector group unprotection via the RESET pin.
• In accordance with CFI (Common Flash Memory Interface)




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