FEATURES
• Glass passivated pellet chip junction
• Low profile package
• Ideal for automated placement
• Low forward voltage drop, low leakage current
• ESD capability
• Meets MSL level 1, per J-STD-020,
LF maximum peak of 260 °C
• Wave and reflow solderable
• AEC-Q101 qualified available
• Compatible to SOD-123W package case outline
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS
General purpose, power line polarity protection, in
commercial, industrial, and automotive applications.

MECHANICAL DATA
Case: SMF (DO-219AB)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - for halogen-free, RoHS-compliant
Base P/NHM3 - for halogen-free, RoHS-compliant, and
AEC-Q101 qualified
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 and HM3 suffix meets JESD 201 class 2 whisker test