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2792844 데이터시트 (PDF) - Chemtronics. All rights reserved

2792844 Datasheet PDF - Chemtronics. All rights reserved
부품명 2792844
다운로드  2792844 다운로드
파일 크기   536.86 Kbytes
페이지   2 Pages
제조업체  CHEMTRONICS [Chemtronics. All rights reserved]
홈페이지  https://www.chemtronics.com/
Logo CHEMTRONICS - Chemtronics. All rights reserved
상세설명 Soder-Wick Lead-Free Desoldering Braid

2792844 Datasheet (PDF)

Go To PDF Page 다운로드 데이터시트
2792844 Datasheet PDF - Chemtronics. All rights reserved

부품명 2792844
다운로드  2792844 Click to download

파일 크기   536.86 Kbytes
페이지   2 Pages
제조업체  CHEMTRONICS [Chemtronics. All rights reserved]
홈페이지  https://www.chemtronics.com/
Logo CHEMTRONICS - Chemtronics. All rights reserved
상세설명 Soder-Wick Lead-Free Desoldering Braid

2792844 데이터시트 (HTML) - Chemtronics. All rights reserved


2792844 제품 세부 정보

Product Description
Soder-Wick Lead-Free is the state of the art in desoldering
technology. It is specially designed for removal of today’s high
temperature lead-free solders. The single layer weave used for
Soder-Wick Lead-Free braid is lighter in mass than any other
desoldering braid available and allows for lead-free solder
removal at lower temperatures. Soder-Wick Lead-Free
responds faster than any other conventional desoldering braid.
This unique design minimizes overheating and requires less
“contact” time thus preventing heat damage to the PCB and
sensitive components. For Lead-Free rework, Soder-Wick has
the answer.

● Fastest wicking and heat transfer
● High capacity for solder uptake
● Halide free, no corrosive residues
● Minimizes risk of heat damage to pads, components and
PBCs
● Can be used with Tin/Lead solders
● RoHS compliant

Typical Applications
Soder-Wick Lead-Free desoldering braid safely removes solder
from:

● Thru-hole Components
● SMT Pads and BGA Pads
● Micro Circuits
● Terminals, Lugs and Posts
● Identification Script

Usage Instructions
For industrial use only. Read SDS carefully prior to use.
1) Choose a Soder-WickÒ Lead-Free braid width equal to
or slightly larger than the pad or connection.
2) Choose a solder iron tip equal to or slightly larger than
the pad or connection.
3) Set temperature of iron between 600-750°F.
4) Place wick on solder joint and place tip of hot iron on
top of wick.
5) As solder becomes molten, the color of the wick will
change from copper to silver.
6) Remove wick and iron from joint simultaneously once
color change has stopped.
7) The component lead / pad is now clean and free from
solder.
8) Clip and discard used portion of the wick
9) If needed, clean PCB with CircuitWorks Lead-Free Flux
Remover Pen CW9400 and remove soils with a
ControlWipes absorbent wipe.

Soder-Wick Is Designed To Meet or Exceed the
Following:
● MIL-F-14256F, Type R
● NASA-STD-8739.3
● DOD-STD-883E, Method 2022
● ANSI/IPC J STD-004, Type ROL0
● BELLCORE TR-NWT-000078
● ANSI/IPC J SF-818

Soder-Wick Bobbins Are Designed To Meet or
Exceed:
● MIL-STD-2000A
● MIL-B-81705C
● MIL-STD-1686C
● MIL-HDBK-263B
● ANSI/IPC J SF-818




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