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LMV1032 데이터시트 (PDF) - Texas Instruments

LMV1032 Datasheet PDF - Texas Instruments
부품명 LMV1032
다운로드  LMV1032 다운로드
파일 크기   576.07 Kbytes
페이지   20 Pages
제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments
상세설명 LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones

LMV1032 Datasheet (PDF)

Go To PDF Page 다운로드 데이터시트
LMV1032 Datasheet PDF - Texas Instruments

부품명 LMV1032
다운로드  LMV1032 Click to download

파일 크기   576.07 Kbytes
페이지   20 Pages
제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments
상세설명 LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones

LMV1032 데이터시트 (HTML) - Texas Instruments


LMV1032 제품 세부 정보

1FEATURES
2• (Typical LMV1032-15, 1.7V Supply; Unless
Otherwise Noted)
• Output Voltage Noise (A-weighted) −89 dBV
• Low Supply Current 60 μA
• Supply Voltage 1.7V to 5V
• PSRR 70 dB
• Signal to Noise Ratio 61 dB
• Input Capacitance 2 pF
• Input Impedance >100 MΩ
• Output Impedance <200Ω
• Max Input Signal 170 mVPP
• Temperature Range −40°C to 85°C
• Large Dome 4-Bump DSBGA Package with
Improved Adhesion Technology.

APPLICATIONS
• Mobile Communications - Bluetooth
• Automotive Accessories
• Cellular Phones
• PDAs
• Accessory Microphone Products

DESCRIPTION
The LMV1032s are an audio amplifier series for small
form factor electret microphones. They are designed
to replace the JFET preamp currently being used.
The LMV1032 series is ideal for extended battery life
applications, such as a Bluetooth communication link.
The addition of a third pin to an electret microphones
that incorporates an LMV1032 allows for a dramatic
reduction in supply current as compared to the JFET
equipped electret microphone. Microphone supply
current is thus reduced to 60 μA, assuring longer
battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed
voltage gains of 6 dB, 15 dB and 25 dB.
The LMV1032 series offers low output impedance
over the voice bandwidth, excellent power supply
rejection (PSRR), and stability over temperature.
The devices are offered in space saving 4-bump ultra
thin DSBGA lead free packages and are thus ideally
suited for the form factor of miniature electret
microphone packages. These extremely miniature
packages have the Large Dome Bump (LDB)
technology. This DSBGA technology is designed for
microphone PCBs requiring 1 kg adhesion criteria.




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