FEATURES
· High Speed (>1000 Mbps) Upgrade for
DS90CP22 2x2 LVDS Crosspoint Switch
· LVPECL Crosspoint Switch Available in
SN65LVCP23
· Low-Jitter Fully Differential Data Path
· 50 ps (Typ), of Peak-to-Peak Jitter With PRBS
= 223–1 Pattern
· Less Than 200 mW (Typ), 300 mW (Max) Total
Power Dissipation
· Output (Channel-to-Channel) Skew Is 10 ps
(Typ), 50 ps (Max)
· Configurable as 2:1 Mux, 1:2 Demux, Repeater
or 1:2 Signal Splitter
· Inputs Accept LVDS, LVPECL, and CML
Signals
· Fast Switch Time of 1.7 ns (Typ)
· Fast Propagation Delay of 0.65 ns (Typ)
· 16 Lead SOIC and TSSOP Packages
· Inter-Operates With TIA/EIA-644-A LVDS
Standard
· Operating Temperature: –40°C to 85°C

APPLICATIONS
· Base Stations
· Add/Drop Muxes
· Protection Switching for Serial Backplanes
· Network Switches/Routers
· Optical Networking Line Cards/Switches
· Clock Distribution

DESCRIPTION
The SN65LVCP22 is a 2´2 crosspoint switch
providing greater than 1000 Mbps operation for each
path. The dual channels incorporate wide
common-mode (0 V to 4 V) receivers, allowing for the
receipt of LVDS, LVPECL, and CML signals. The
dual outputs are LVDS drivers to provide low-power,
low-EMI, high-speed operation. The SN65LVCP22
provides a single device supporting 2:2 buffering
(repeating), 1:2 splitting, 2:1 multiplexing, 2´2
switching, and LVPECL/CML to LVDS level
translation on each channel. The flexible operation of
the SN65LVCP22 provides a single device to support
the redundant serial bus transmission needs (working
and protection switching cards) of fault-tolerant switch
systems found in optical networking, wireless
infrastructure, and data commu- nications systems. TI offers additional gigibit repeater/ translator and
crosspoint products in the SN65LVDS100 and
SN65LVDS122.
The SN65LVCP22 uses a fully differential data path
to ensure low-noise generation, fast switching times,
low pulse width distortion, and low jitter. Output
channel-to- channel skew is less than 10 ps (typ) and
50 ps (max) to ensure accurate alignment of outputs
in all applications. Both SOIC and TSSOP package
options are available to allow easy upgrade for
existing solutions, and board area savings where
space is critical.