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SN74LVC2G125 데이터시트 (PDF) - Texas Instruments

SN74LVC2G125 Datasheet PDF - Texas Instruments
부품명 SN74LVC2G125
다운로드  SN74LVC2G125 다운로드
파일 크기   760.14 Kbytes
페이지   30 Pages
제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments
상세설명 SN74LVC2G125 Dual Bus Buffer Gate With 3-State Outputs

SN74LVC2G125 Datasheet (PDF)

Go To PDF Page 다운로드 데이터시트
SN74LVC2G125 Datasheet PDF - Texas Instruments

부품명 SN74LVC2G125
다운로드  SN74LVC2G125 Click to download

파일 크기   760.14 Kbytes
페이지   30 Pages
제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments
상세설명 SN74LVC2G125 Dual Bus Buffer Gate With 3-State Outputs

SN74LVC2G125 데이터시트 (HTML) - Texas Instruments


SN74LVC2G125 제품 세부 정보

1 Features
1• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model
– 1000-V Charged-Device Model
• Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 4.3 ns at 3.3 V
• Low Power Consumption, 10-μA Max ICC
• ±24-mA Output Drive at 3.3 V
• Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
• Typical VOHV (Output VOH Undershoot)
> 2 V at VCC = 3.3 V, TA = 25°C
• Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection
• Can Be Used as a Down Translator to Translate
Inputs From a Max of 5.5 V Down
to the VCC Level
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II

2 Applications
• Cable Modem Termination Systems
• High-Speed Data Acquisition and Generation
• Military: Radars and Sonars
• Motor Controls: High-Voltage
• Power Line Communication Modems
• SSDs: Internal or External
• Video Broadcasting and Infrastructure: Scalable
Platforms
• Video Broadcasting: IP-Based Multi-Format
Transcoders
• Video Communications Systems

3 Description
The SN74LVC2G125 device is a dual bus buffer
gate, designed for 1.65-V to 5.5-V VCC operation.
This device features dual line drivers with 3-state
outputs. The outputs are disabled when the
associated output-enable (OE) input is high.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
To ensure the high-impedance state during power up
or power down, OE should be tied to VCC through a
pullup resistor; the minimum value of the resistor is
determined by the current-sinking capability of the
driver.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.




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