1 Features
1• Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design
• 9 mm × 15mm × 2.8mm package
- Pin Compatible with LMZ31506
• Efficiencies Up To 95%
• Wide-Output Voltage Adjust
0.8 V to 5.5 V, with 1% Reference Accuracy
• Optional Split Power Rail Allows
Input Voltage Down to 1.6 V
• Adjustable Switching Frequency
(330 kHz to 780 kHz)
• Synchronizes to an External Clock
• Adjustable Slow-Start
• Output Voltage Sequencing / Tracking
• Power Good Output
• Programmable Undervoltage Lockout (UVLO)
• Overcurrent Protection (Hiccup-Mode)
• Over Temperature Protection
• Pre-bias Output Start-up
• Operating Temperature Range: –40°C to +85°C
• Enhanced Thermal Performance: 13°C/W
• Meets EN55022 Class B Emissions
- Integrated Shielded Inductor
• Create a Custom Design Using the LMZ31503
With the WEBENCH® Power Designer

2 Applications
• Broadband & Communications Infrastructure
• Automated Test and Medical Equipment
• Compact PCI / PCI Express / PXI Express
• DSP and FPGA Point of Load Applications
• High Density Distributed Power Systems

3 Description
The LMZ31503 power module is an easy-to-use
integrated power solution that combines a 3-A DC/DC
converter with power MOSFETs, a shielded inductor,
and passives into a low profile, QFN package. This
total power solution allows as few as 3 external
components and eliminates the loop compensation
and magnetics design process.
The 9×15×2.8 mm QFN package is easy to solder
onto a printed circuit board and allows a compact
point-of-load design with up to 95% efficiency and
excellent power dissipation with a thermal impedance
of 13°C/W junction to ambient. The device delivers
the full 3-A rated output current at 85°C ambient
temperature without airflow.
The LMZ31503 offers the flexibility and the featureset
of a discrete point-of-load design and is ideal for
powering performance DSPs and FPGAs. Advanced
packaging technology afford a robust and reliable
power solution compatible with standard QFN
mounting and testing techniques.