1 Features
• Available in the Texas Instruments NanoStar™
Packages
• Single-Supply Voltage Translator
• 1.8 V to 3.3 V (at VCC = 3.3 V)
• 2.5 V to 3.3 V (at VCC = 3.3 V)
• 1.8 V to 2.5 V (at VCC = 2.5 V)
• 3.3 V to 2.5 V (at VCC = 2.5 V)
• Nine Configurable Gate Logic Functions
• Schmitt-Trigger Inputs Reject Input Noise and
Provide Better Output Signal Integrity
• Ioff Supports Partial-Power-Down Mode With Low
Leakage Current (0.5 μA)
• Very Low Static and Dynamic Power Consumption
• Pb-Free Packages Available: SON (DRY or DSF),
SOT-23 (DBV), SC-70 (DCK), and NanoStar
WCSP
• Latch-Up Performance Exceeds 100 mA Per JESD
78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
• Related Devices: SN74AUP1T98, SN74AUP1T57,
and SN74AUP1T58

2 Description
AUP technology is the industry's lowest-power logic
technology designed for use in battery-operated or
battery backed-up equipment. The SN74AUP1T97 is
designed for logic-level translation applications with
input switching levels that accept 1.8-V LVCMOS
signals, while operating from either a single 3.3-V or
2.5-V VCC supply.
The wide VCC range of 2.3 V to 3.6 V allows the
possibility of battery voltage drop during system
operation and ensures normal operation between this
range.
Schmitt-trigger inputs (ΔVT = 210 mV between
positive and negative input transitions) offer improved
noise immunity during switching transitions, which is
especially useful on analog mixed-mode designs.
Schmitt-trigger inputs reject input noise, ensure
integrity of output signals, and allow for slow input
signal transition.
The SN74AUP1T97 can be easily configured to
perform a required gate function by connecting A, B,
and C inputs to VCC or ground (see Function
Selection table). Up to nine commonly used logic gate
functions can be performed.
Ioff is a feature that allows for powered-down
conditions (VCC = 0 V) and is important in portable
and mobile applications. When VCC = 0 V, signals in
the range from 0 V to 3.6 V can be applied to the
inputs and outputs of the device. No damage occurs
to the device under these conditions.
The SN74AUP1T97 is designed with optimized
current-drive capability of 4 mA to reduce line
reflections, overshoot, and undershoot caused by
high-drive outputs.
NanoStar package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.