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TPSM53604 데이터시트 (PDF) - Texas Instruments

TPSM53604 Datasheet PDF - Texas Instruments
부품명 TPSM53604
다운로드  TPSM53604 다운로드
파일 크기   1616.98 Kbytes
페이지   36 Pages
제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments
상세설명 TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package

TPSM53604 Datasheet (PDF)

Go To PDF Page 다운로드 데이터시트
TPSM53604 Datasheet PDF - Texas Instruments

부품명 TPSM53604
다운로드  TPSM53604 Click to download

파일 크기   1616.98 Kbytes
페이지   36 Pages
제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments
상세설명 TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package

TPSM53604 데이터시트 (HTML) - Texas Instruments


TPSM53604 제품 세부 정보

1 Features
• Functional Safety-Capable
– Documentation available to aid functional safety
system design
• 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN
package
– Industry’s smallest 36-V, 4-A footprint:
85 mm2 solution size (single sided)
– Low EMI: meets CISPR11 radiated emissions
– Excellent thermal performance:
up to 20 W output power at 85°C, no airflow
– Standard footprint: single large thermal pad and
all pins accessible from perimeter
• Input voltage range: 3.8 V to 36 V
• Output voltage range: 1 V to 7 V
• Efficiency up to 95%
• Power-good flag
• Precision enable
• Built-in hiccup-mode short-circuit protection, overtemperature
protection, start-up into pre-bias
output, soft start, and UVLO
• Operating IC junction range: –40°C to +125°C
• Operating ambient range: –40°C to +105°C
• Shock and vibration tested to Mil-STD-883D
• Pin compatible with: 3-A TPSM53603
and 2-A TPSM53602
• Create a custom design using the TPSM53604
with the WEBENCH® Power Designer
• Download the EVM Design Files for fast board
design

2 Applications
• General purpose wide VIN power supplies
• Factory automation and control
• Test and measurement
• Aerospace and defense
• Negative output voltage applications

3 Description
The TPSM53604 power module is a highly integrated
4-A power solution that combines a 36-V input,
step-down, DC/DC converter with power MOSFETs,
a shielded inductor, and passives in a thermallyenhanced
QFN package. The 5-mm x 5.5-mm x 4-
mm, 15-pin package uses Enhanced HotRod QFN
technology for improved thermal performance, small
footprint, and low EMI. The package footprint has all
pins accessible from the perimeter and a single large
thermal pad for simple layout and easy handling in
manufacturing.
The total solution requires as few as four
external components and eliminates the loop
compensation and magnetics part selection from
the design process. The full feature set includes
power good, programmable UVLO, prebias start-up,
overcurrent, and overtemperature protections, making
the TPSM53604 an excellent device for powering a
wide range of applications.




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