1.1 Features 1
• Module Solution Based on TI's CC2564B Dual-
Mode Bluetooth®, Available in Two Variants:
– CC2564MODA With Integrated Antenna
– CC2564MODN With External Antenna
• Fully Certified Module for FCC, IC, CE, and
Bluetooth 4.1
– FCC (Z64-2564N), IC (451I-2564N) Modular
Grant (see Section 6.2.1.3, Section 7.1.1, and
Section 7.1.2)
– CE Certified as Summarized in the Declaration
of Conformity (see Section 7.1.3)
– Bluetooth 4.1 Controller Subsystem Qualified
(CC2564MODN: QDID 55257; CC2564MODA:
QDID 64631). Compliant up to the HCI Layer
• Highly Optimized for Design Into Small Form
Factor Systems and Flexibility:
– CC2564MODA
– Integrated Chip Antenna
– Module Footprint: 35 Terminals, 0.8-mm
Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
– CC2564MODN
– Single-Ended 50-Ω RF Interface
– Module Footprint: 33 Terminals, 0.8-mm
Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
• BR and EDR Features Include:
– Up to Seven Active Devices
– Scatternet: Up to Three Piconets
Simultaneously, One as Master and Two as
Slaves
– Up to Two Synchronous Connection Oriented
(SCO) Links on the Same Piconet
– Support for All Voice Air-Coding—Continuously
Variable Slope Delta (CVSD), A-Law, μ-Law,
and Transparent (Uncoded)
– Assisted Mode for HFP 1.6 Wideband Speech
(WBS) Profile or A2DP Profile to Reduce Host
Processing and Power
– Support of Multiple Bluetooth Profiles With
Enhanced QoS
• Low Energy Features Include:
– Support of up to 10 Simultaneous Connections
– Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption
– Independent Buffering for Low Energy Allows
Large Numbers of Multiple Connections Without
Affecting BR or EDR Performance
– Built-In Coexistence and Prioritization Handling
for BR, EDR, and Low Energy
• Best-in-Class Bluetooth (RF) Performance (TX
Power, RX Sensitivity, Blocking)
– Class 1.5 TX Power up to +10 dBm
– –93 dbm Typical RX Sensitivity
– Internal Temperature Detection and
Compensation to Ensure Minimal Variation in
RF Performance Over Temperature, No
External Calibration Required
– Improved Adaptive Frequency Hopping (AFH)
Algorithm With Minimum Adaptation Time
– Provides Longer Range, Including Twice the
Range of Other Low-Energy-Only Solutions
• Advanced Power Management for Extended
Battery Life and Ease of Design
– On-Chip Power Management, Including Direct
Connection to Battery
– Low Power Consumption for Active, Standby,
and Scan Bluetooth Modes
– Shutdown and Sleep Modes to Minimize Power
Consumption
• Physical Interfaces:
– UART Interface With Support for Maximum
Bluetooth Data Rates
– UART Transport Layer (H4) With Maximum
Rate of 4 Mbps
– Three-Wire UART Transport Layer (H5) With
Maximum Rate of 4 Mbps
– Fully Programmable Digital Pulse-Code
Modulation (PCM)–I2S Codec Interface
• CC256x Bluetooth Hardware Evaluation Tool:
PC-Based Application to Evaluate RF Performance
of the Device and Configure Service Pack

1.2 Applications
• Mobile Accessories
• Sports and Fitness Applications
• Wireless Audio Solutions
• Set-Top Boxes and Remote Controls
• Toys
• Test and Measurement
• Industrial: Cable Replacement
• Wireless Sensors
• Automotive Aftermarket
• Wellness and Health

1.3 Description
The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy
HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's
seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant.
The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this
device; and the device includes a royalty-free software stack compatible with several host MCUs and
MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive
sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only
solutions.
Furthermore, TI’s power-management hardware and software algorithms provide significant power savings
in all commonly used Bluetooth BR/EDR and low energy modes of operation.
The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and
MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors
can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software
packages. Multiple profiles and sample applications, including the following, are supported:
• Serial port profile (SPP)
• Advanced audio distribution profile (A2DP)
• Audio/video remote control profile (AVRCP)
• Hands-free profile (HFP)
• Human interface device (HID)
• Generic attribute profile (GATT)
• Several Bluetooth low energy profiles and services
For more information, see TI Dual-Mode Bluetooth Stack.
In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available
for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wirelessconnectivity/
dual-mode-bluetooth page.