DESCRIPTION
Halide-free no-clean flux conforming to DIN-EN 29454-1 type 2.2.3.A (DIN 8511, F-SW34).
Stannol 500-3431BF is based on the well established Stannol 500-3431 with an increased solid content to provide enhanced
activity, which is required for lead-free soldering. The new formula of the activators guarantees an optimum wetting of the
different surfaces (such as OSP, Ni/Au, HAL) used in PCB manufacturing and so avoids problems when new printed circuit
boards with alternative surfaces are introduced.
A low resin percentage (<0.2%) was integrated into the flux formulation in order to meet the requirements on the soldering
behaviour of the flux and the electrical safety of the residues left after soldering.
APPLICATION
Stannol 500-3431BF has been developed for the application with spray fluxers, but foam fluxers can also be used. The
preheat temperature should be at least 90° C measured on the surface of the circuit board when entering the solder wave.
This temperature ensures the evaporation of the solvent and a sufficient activation of the flux.
Evaporation of solvent can change the composition. Evaporation causes an increase of the solid content and therefore the
density increases. This can be checked with the Stannol Mini-Titration-Kit.