1 Features
Key Features
• Integrated DSP for audio processing
• 24-V Supply for class-d output stage
• Y-Bridge multi-level supply architecture
• Hybrid-pro external boost control algorithm
• Ultrasonic output support up to 40 kHz
Output power:
• 25 W, 1% THD+N (4 Ω, 18 V)
• 30 W Maximum output power, 10% THD+N
Efficiency (1% THDN) and power consumption
• 82% at 1W, 4 Ω, PVDDH = 12 V, PVDDL = 3.8 V
• 83% at 1W, 8 Ω, PVDDH = 18 V, PVDDL = 5 V
• 84% at 1W, 4 Ω, PVDDH = 18 V, PVDDL = 5 V
• 90% at 15W, 4 Ω, PVDDH = 18 V, PVDDL = 5 V
• 93% at 15W , 8 Ω, PVDDH = 18 V, PVDDL = 5 V
• <0.5 μA in Hardware Shutdown Mode
Power supplies and management:
• AVDD: 1.8 V
• IOVDD: 1.8 V/ 3.3 V
• PVDDL: 2.7 V to 5.5 V
• PVDDH: 3 V to 24 V
Interfaces and Control:
• SDOUT for echo cancellation
• I2S/TDM: 8 channels of 32 bits up to 192 KSPS
• I2C with fast mode+ or SPI
• Inter-chip communication bus
• 16 kHz to 192 kHz sample rates
Advanced DSP audio processing:
• Real-time IV-sense for speaker protection
• Dynamic range compressor
• Brownout protection with power limiter
• Multi-channel balancing communication
Protection and EMI:
• Over power and low battery protection
• PVDDH/ PVDDL supply tracking limiters
• Thermal and over current protections
• Thermal foldback
• Post filter feedback and slew rate control