Applications
——Cluster, Button Backlighting
——Custom Tuning
——Electronic Equipment
——Head-Up Display LED & Laser
——Industrial Automation (Machine Controls, Light
Barriers, Vision Controls)
——Interior Illumination (e.g. Ambient Map)
——Transportation, Plane, Ship
Features:
——Package: SMD ceramic package with silicone lens
——Chip technology: ThinGaN
——Typ. Radiation: 90°
——Color: Cx = 0.32, Cy = 0.32 acc. to CIE 1931 (● ultra white)
——Optical efficacy: 61 lm/W
——Corrosion Robustness Class: 3B
——Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C,
Stress Test Qualification for Automotive Grade Discrete Semiconductors.
——ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)