FEATURES

Lead less chip form, no lead damage

Lead-free solder joint, no wire bond & lead frame

Low power loss, high efficiency

High current capability, low VF

Plastic package has underwriters laboratory flammability

       Classification 94V-0

APPLICATION

Switching mode power supply applications

Portable equipment battery applications

High frequency rectification

DC / DC converter

Telecommunication

MECHANICAL DATA

Case: Packed with FRP substrate and epoxy underfilled

Terminals: Pure tin-plated (lead-free), solderable per MIL-STD-750, method 2026.

Polarity: Laser cathode band marking

Weight : 0.003 gram