Description

Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on resistance and cost-effectiveness.

The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing.

Isolated Package

High Voltage Isolation = 2.5KVRMS

Sink to Lead Creepage Dist. 4.8mm

Logic-Level Gate Drive

RDS(ON) Specified at VGS = 4V & 5V

Fast Switching

Ease of paralleling