Features
 Ideal for automated placement
 Ultra low forward voltage drop, low power loss
 High efficiency operation
 Low thermal resistance
 Ultra thin profile package for space constrained utilization
 Easy pick and place package suitable for automated handling
 Lead free in compliance with EU RoHS 2011/65/EU directive
 Green molding compound as per IEC61249 Std. . (Halogen Free)

Mechanical Data
 Case: TO-277B package
 Terminals: solder plated, solderable per MIL-STD-750,Method 2026
 Weight: 0.0038 ounces, 0.1088 grams.
 Marking: Part number