Description
The OP955 devices consists of a PIN silicon photodiode molded in a clear epoxy package which allows spectral response from visible to infrared wavelengths. The wide receiving angle provides relatively even reception over a large area. The side-looking package is designed for easy PC board mounting. The lensing effect of the package allows an acceptance half angle of 45o measured from the optical axis to the half power point. These devices are 100% production tested using infrared light for close correlation with Optek’s GaAs and GaAlAs emitters.

Features
·Wide receiving angle
·Linear response vs. irradiance
·Fast switching time
·Side-looking package ideal for space limited applications

Absolute Maximum Ratings (TA = 25℃ unless other wise noted)
Reverse Breakdown Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 V
Storage and Operating Temperature Range . . . . . . . . . . . . . . . . . . -40℃ to +100℃
Lead Soldering Temperature [1/16 inch (1.6 mm) from case for 5 sec. with soldering iron] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260℃
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mW