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1705452 데이터시트 (PDF) - PHOENIX CONTACT

부품명	1705452

상세설명	Coding profile, inserted into the hole on the plug, made from red insulating material, diameter: 1.35 mm

파일 크기	49.1 Kbytes

Html View	1

제조업체	PHOENIX [PHOENIX CONTACT]

홈페이지	http://www.phoenixcontact.com

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1705452 데이터시트 (PDF) - PHOENIX CONTACT

유사한 부품 번호 - 1705452

제조업체	부품명	데이터시트	상세설명
Molex Electronics Ltd.	1705451054	38Kb / 2P	EdgeLineESP, Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB
Molex Electronics Ltd.	1705451150	38Kb / 2P	EdgeLine ESP, Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB

유사한 설명 - 1705452

제조업체	부품명	데이터시트	상세설명
BRIGHT LED ELECTRONICS ...	BM-10EG57ND	305Kb / 3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-10EG58MD	482Kb / 3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-10EG88MD	488Kb / 3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-10EG88ND	742Kb / 3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-20EG57MD	357Kb / 3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-20EG57ND	411Kb / 3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-20EG88MD	596Kb / 3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-41EG57MD	413Kb / 3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-41EG57ND	736Kb / 3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
Surge Components	SPH2G331MND3045	263Kb / 2P	The capacitor can be inserted into the PCB board

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