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부품명	SOT926-1

상세설명	plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm

파일 크기	239.43 Kbytes

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제조업체	PHILIPS [NXP Semiconductors]

홈페이지	http://www.nxp.com

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유사한 부품 번호 - SOT926-1

제조업체	부품명	데이터시트	상세설명
NXP Semiconductors	SOT926-1	2Mb / 153P	32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals Rev. 4-26 March 2013
NXP Semiconductors	SOT926-1	2Mb / 149P	32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller Rev. 6.1-7 February 2013

제조업체	부품명	데이터시트	상세설명
Mosel Vitelic, Corp	MS7200L	175Kb / 11P	256 x 9, 512 x 9, 1K x 9 CMOS FIFO
Integrated Device Techn...	IDT7203	147Kb / 14P	CMOS ASYNCHRONOUS FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9
	IDT72421	196Kb / 14P	CMOS SyncFIFOO 64 X 9, 256 x 9, 512 x 9, 1024 X 9, 2048 X 9 and 4096 x 9
	IDT72V201	115Kb / 14P	3.3 VOLT CMOS SyncFIFO??256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9
STATS ChipPAC, Ltd.	FBGA	559Kb / 2P	Fine Pitch Ball Grid Array
Integrated Device Techn...	IDT72201	199Kb / 19P	CMOS SyncFIFO 64 X 9, 256 x 9, 512 x 9, 1024 X 9, 2048 X 9 and 4096 x 9
fujitsu semiconductor	BGA-320P-M06	34Kb / 1P	PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
ILSI America LLC	ISM61	104Kb / 2P	9 mm x 14 mm Plastic Package SMD Oscillator, TTL / HC-MOS
Integrated Device Techn...	7203L25J	311Kb / 10P	CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9 8,192 x 9, 16,384 x 9
NXP Semiconductors	NAFE11388	226Kb / 7P	thermal enhanced very thin quad flat package, no leads, dimple wettable flank; 64 terminals, 0.5 mm pitch, 9 mm x 9 mm x 0.85 mm body Rev. 1-29 December 2021