21-0104 pdf, 21-0104 상세설명, 21-0104 데이터시트, 21-0104 view ::: ALLDATASHEET :::

부품명	21-0104

상세설명	PACKAGE OUTLINE, 12BUMPS, 3*4ARRAY, UCSP(B)PKG.

파일 크기	40.25 Kbytes

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제조업체	MAXIM [Maxim Integrated Products]

홈페이지	https://www.maximintegrated.com/en.html

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유사한 부품 번호 - 21-0104

제조업체	부품명	데이터시트	상세설명
Dallas Semiconductor	21-0102	109Kb / 2P	PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
Maxim Integrated Produc...	21-0108	71Kb / 2P	PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD Rev K
Maxim Integrated Produc...	21-0109B	35Kb / 1P	PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD Rev B

제조업체	부품명	데이터시트	상세설명
Dallas Semiconductor	21-0117G	57Kb / 1P	PACKAGE OUTLINE, 2x2 UCSP
Zetex Semiconductors	MLP322	176Kb / 3P	Surface mounted, 3 pin package Package outline
Zetex Semiconductors	TO92	87Kb / 2P	Through hole, 3 pin package Package outline
Maxim Integrated Produc...	21-0093	38Kb / 1P	PACKAGE OUTLINE, 9 BUMPS, 3*3 ARRAY, UCSP(B)PKG. Rev M
	21-0491	52Kb / 1P	PACKAGE OUTLINE 16 BUMPS WLP PKG. 0.4MM PITCH REV .G
	21-0542	52Kb / 1P	PACKAGE OUTLINE 12 BUMPS, WLP PKG, 0.4MM PITCH REV .C
	21-0548	47Kb / 1P	PACKAGE OUTLINE 30 BUMPS, WLP PKG. 0.4MM PITCH REV .D
	21-0576	56Kb / 2P	PACKAGE OUTLINE, 20L 440.85MM QFN PKG, WITH DIMPLE LEADS REV .A
	21-0577	55Kb / 1P	PACKAGE OUTLINE, 28 BUMPS WLP PKG. (HIGH CURRENT) O.5MM PITCH REV .A
	21-0612	37Kb / 1P	PACKAGE OUTLINE, 4 BUMPS THIN WLP PKG. 0.4MM PITCH REV .A