21-0108 pdf, 21-0108 상세설명, 21-0108 데이터시트, 21-0108 view ::: ALLDATASHEET :::

부품명	21-0108

상세설명	PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD

파일 크기	71.39 Kbytes

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제조업체	MAXIM [Maxim Integrated Products]

홈페이지	https://www.maximintegrated.com/en.html

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유사한 부품 번호 - 21-0108

제조업체	부품명	데이터시트	상세설명
Dallas Semiconductor	21-0102	109Kb / 2P	PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
Maxim Integrated Produc...	21-0104	40Kb / 1P	PACKAGE OUTLINE, 12BUMPS, 3*4ARRAY, UCSP(B)PKG. Rev G
Maxim Integrated Produc...	21-0109B	35Kb / 1P	PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD Rev B

제조업체	부품명	데이터시트	상세설명
Integrated Circuit Solu...	ICS280	160Kb / 8P	Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body)
Maxim Integrated Produc...	21-0109B	35Kb / 1P	PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD Rev B
Elantec Semiconductor	MDP0040	149Kb / 1P	PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
STATS ChipPAC, Ltd.	QFP-EP	117Kb / 2P	Exposed Pad Quad Flat Pack
Protek Devices	DFN-2-0402	280Kb / 5P	package outline & pad layout
Maxim Integrated Produc...	21-0066	42Kb / 1P	PACKAGE OUTLINE, TSSOP 4.40MM BODY Rev L
	21-0111	31Kb / 1P	PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD Rev E
	21-0137	48Kb / 2P	PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 330.80MM Rev J
	90-0117	29Kb / 1P	PACKAGE LAND PATTERN, (U16) 4.4MM TSSOP, 16 LEADS Rev C
	90-0171	28Kb / 1P	PACKAGE LAND PATTERN, (U28) 4.4MM TSSOP Rev B